Electrical

Active Tuning of Spring Constant and Resonant Frequency

Mechanical characteristics such as spring constants and resonant frequencies of beams and membranes can be changed by introducing strain. In this section, we focus on discussing methods for tuning characteristics of cantilever beams to exemplify the methodology. For cantilevers, longitudinal strain can be introduced by axial or transverse loading forces. We will discuss these two

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Dynamic System, Resonant Frequency, and Quality Factor

A mass spring damper system

A MEMS system, including sensors and actuators, invariably consists of mass and supporting structures. The supporting mechanical elements (membranes, cantilever, or suspensions) provide elastic restoring spring constants. Movement of the mass is impeded by collision with air molecules surrounding the mass. This constitutes damping, which is a velocity-dependant resistance force. As such, a MEMS system

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Conductivity of Semiconductor – Pedagogy Zone

Conductivity of Semiconductor

Silicon, an element commonly found on sandy beaches and in window glasses, is the substrate of choice for building integrated circuits. Silicon belongs to a class of materials called semiconductors. which offers remarkable electrical characteristics and controllability for electronics circuits. Semiconductor silicon is the most common material in the MEMS field. Naturally, the electrical and

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The Microelectronics Fabrication Process Flow

Fabrication process for an integrated circuit

A basic understanding of the fabrication technology for integrated circuit, which precedes that of MEMS in history, is necessary to understanding the micromachining process. A reader who is familiar with the basic microfabrication process of integrated circuits may skip this section. A fabrication process for integrated circuits generally involves many steps of material deposition, material

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